Semiconductor: Split plot computer chip data from Littell et al. (2006).
Description
Littell et al. (2006) use the data here to introduce analysis of split plot
designs using mixed models. Twelve silicon wafers were randomly selected from
a lot, and were randomly assigned to four different processing modes.
Resistance on the chips was measured in four different positions (four different
chips) on each wafer. Mode of processing and position of chips were fixed
factors, while wafer was a random effect. The experimental units with respect
to process are the wafers. The experimental units with respect to position
are individual chips. Thus the wafer is the whole plot, while the positions
(chips) are split plot units
Usage
data(Semiconductor)
Arguments
source
Littell, R. C., Milliken, G. A., Stroup, W. W., Wolfinger, R. D., and O. Schabenberger.
2006. SAS for mixed models 2nd ed. SAS press.