solder: Soldering of Components on Printed-Circuit Boards
Description
Same data as in rpart:
The solder data frame has 720 rows and 6 columns, representing
a balanced subset of a designed experiment varying 5 factors on the
soldering of components on printed-circuit boards.
Usage
solder
Arguments
Format
This data frame contains the following columns:
Opening
a factor with levels
LMS
indicating the amount of clearance around the mounting pad.
Solder
a factor with levels
ThickThin
giving the thickness of the solder used.
Mask
a factor with levels
A1.5A3B3B6
indicating the type and thickness of mask used.
PadType
a factor with levels
D4D6D7L4L6L7L8L9W4W9
giving the size and geometry of the mounting pad.
Panel
1:3 indicating the panel on a board being tested.
skips
a numeric vector giving the number of visible solder skips.
Source
John M. Chambers and Trevor J. Hastie eds. (1992)
Statistical Models in S, Wadsworth and Brooks/Cole,
Pacific Grove, CA 1992.